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Electrical Modeling of Microwave IC Packaging.
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ECE Home PageA circuit topology is described for modeling a class of plastic surface mount packages. The model consists of three pieces each of which is circuit modeled based on an electromagnetic simulation. The resulting parts of the model can then be
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A simple model is presented for approximate calculations of the lowest order resonance frequencies of low cost MMIC packages. The model shows the effect of seal ring characteristics such as dielectric constant and via holes. Experimental results confirm the usefulness of the model.
Jackson, R.W., "Simple Electromagnetic Model for Determining Resonance Frequencies in Low Cost MMIC Packages," IEEE Trans. Microwave Theory and Techniques (special issue on Packaging and Interconnects), Vol. 42, pp.-,September 1994.
At high frequencies, grounded coplanar waveguide MMIC circuits can be prone to destructive inter-circuit coupling effects due to substrate resonances. Analytic formulas for a simple circuit model of this coupling are presented in this paper Jackson, R.W., "Circuit Model for Resonance Coupling in Grounded Coplanar Waveguide Circuits," IEEE Trans. Microwave Theory and Techniques (special issue on Coplanar MMICs), Vol. 41, pp. 1641-1645, September 1993.
A novel formulation is presented for the method of moments solution of shielded, enclosed microstrip MMIC circuits. The technique involves first computing a circuit's mutual impedance characteristics with no lateral enclosure and then addin Jackson, R.W., "The Use of Sidewall Images to Compute Package Effects in MoM Analysis of MMIC Circuits," IEEE Trans. on Microwave Theory and Techniques, Vol. 41, pp. 406-414, March 1993.
Neglecting the effect of enclosing an MMIC in a resonant conducting package can have undesirable consequences such as power loss, poor isolation, and circuit instabilities In principle these effects can be predicted by currently available CAD
Burke, J.J. and R.W. Jackson, "A Simple Circuit Model for Resonant Mode Coupling in Packaged MMICs," IEEE Microwave Theory and Techniques Symposium Digest, pp. 1221-1224, June 1991.
